Join us at the APEC 2025 Conference!

APEC 2025 is an event for experts in the fields of power electronic devices.

Meet our expert to discuss IC packaging solutions, processes, materials, components, & innovative technology designed to answer your needs: We look forward to meeting you! Schedule a meeting now.

• High Performance / High Reliability
• Top-level IC Packaging Solutions (Flip Chip, 2.5D, 3d & more)
• Advanced Assy. Processes (high efficiency, time & cost saving)
• Custom Substrate Design Options