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IC packaging ebook

The eBook of
IC Packaging Unique Solutions

Based on 4 Key Pillars of IC Packaging

IC packaging ebook

This eBook provides highly focused articles that explore a wide range of practical solutions addressing the demands of today’s IC package design, functionality, reliability and performance requirements.

4 Key Pillars of IC Packaging:

  • Organic Substrates
  • IC Packaging Technology
  • Advanced Packaging
  • Thermal Management 

Learn about advanced processes, materials and features, design challenges, best-practices & workarounds, plus exciting new developments.

Our eBook, contains vital information for IC package designers & engineers, especially relating to defense, aerospace and medical device sectors. DOWNLOAD NOW.

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THE AUTHORS

yaniv_maydar-1

Yaniv Maydar

VP R&D and Innovation at PCB Technologies

Yaad

Yaad Eliya

CTO at PCB Technologies

ABOUT iNPACK

iNPACK (a PCB Technologies Company) goes beyond design limits to offer cutting-edge semiconductor and electronics assembly, testing, and IC package design, including LGA, BGA, and 2D & 3D customized solutions.  Featuring fully supported automated processes, MW microelectronics assemblies, System-in-Package (SiP) and heterogeneous integration. Providing high-level expertise in organic substrate design and manufacturing based on advanced materials, subtractive, and mSAP processes. Also offering standard and custom substrate solutions for specific use cases.

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