
JOIN US AT THE IMAPS CONFERENCE / EXHIBITION
Visit the iNPACK Booth, #506 where there's so much to see and a terrific tech-team to connect with.
Check out the unique IC packaging solutions + processes, materials, components, & innovative technology designed to answer your needs:
- High Performance / High Reliability
- Top-level IC Packaging Solutions (Flip Chip, 2.5D, 3d & more)
- Advanced Fab. & Assy. Processes (high efficiency, time & cost saving)
- Custom Substrate Design Options