Join us at the IMAPS Symposium 2025 Conference!

Visit the iNPACK Booth, #702 where there's so much to see and a terrific tech-team to connect with.

Check out the unique IC packaging solutions + processes, materials, components, & innovative technology designed to answer your needs: We look forward to meeting you! Schedule a meeting now.

• High Performance / High Reliability
• Top-level IC Packaging Solutions (Flip Chip, 2.5D, 3d & more)
• Advanced Fab. & Assy. Processes (high efficiency, time & cost saving)
• Custom Substrate Design Options
  
  We look forward to meeting you! Schedule a meeting now.