March 25th | King’s Conference Centre, Southampton

A Focused Technical Deep Dive for Advanced Electronics Professionals

Join PCB Technologies and iNPACK for an exclusive technical deep dive designed for engineers and decision-makers in advanced electronics.

In collaboration with Micon & MCS – bringing complementary expertise across the electronics ecosystem.

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Event Agenda

09:30 – 10:00: Registration & Welcome Coffee

10:00 – 10:15: Introductions – All-in-One Presentation (Ronen Sharashov- Commercial Director EMEA)

10:15 – 11:00: Thermal Management in Advanced Electronic Design
Board and system-level thermal architecture, materials, stack-up strategy and simulation-driven decision-making (Yaad Eliya - CTO)

11:00 – 11:15: Coffee Break 

11:15 – 12:00: Embedded Passive Components in Multilayer PCBs
Design integration, performance benefits, reliability impact and manufacturing boundaries (Yaad Eliya - CTO)

12:00 – 13:00: Networking Lunch

13:00 – 13:45: INPACK all in one integration solutions (Yaniv Maydar- GM INPACK)

13:45 – 14:00: Coffee Break

14:00 – 14:45: From concept to production the INPACK way - Advanced packaging (Adva Braymok Laufer - Director of program management)

14:45 – 15:00: Micon Introduction

15:00 – 15:45: Semiconductors, Solder Joints and Sausages – MCS
(Stewart McCracken, Founder & CEO)

16:00 – 16:10: Closing Remarks – Building Lasting Partnerships

16:10 – 17:30: Networking Drinks / One-on-One Discussions

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** Contact details are shared between event partners PCB Technologies, iNPACK, MCS and Micon.